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Experiments with the bonding machine Show image information
Quality evaluation of bonded interconnects using a shear tester. Show image information
Reliability analysis of a friction clutch. Show image information
Lab work in teaching. Show image information
Transport of fine powder using ultrasonic vibrations Show image information

Experiments with the bonding machine

Quality evaluation of bonded interconnects using a shear tester.

Reliability analysis of a friction clutch.

Lab work in teaching.

Transport of fine powder using ultrasonic vibrations

Dynamics and Mechatronics (LDM)

Members of the Chair of Dynamics and Mechatronics

Collin Dymel, M.Sc.

Contact
Publications
 Collin Dymel, M.Sc.

Dynamics and Mechatronics (LDM)

Research Assistant - Ultrasonic bonding, sensors and actuators

Phone:
+49 5251 60-1820
Fax:
+49 5251 60-1803
Office:
P1.3.34
Office hours:

Montags / Mittwochs 07:30-08:30

Web:
Visitor:
Pohlweg 47-49
33098 Paderborn


Open list in Research Information System

2019

Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding

R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical (2019), 295, pp. 653 - 662

Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.


2018

Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process

C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1-6

State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach.


Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding

C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41-44

Ultrasonic bonding and welding are common friction based approaches in the assembly of power electronics. Interconnections with cross-sections of 0.3 mm² up to 12 mm² made from copper are well suited in high power applications. For increasing friction energy, which is responsible for bond formation, a two-dimensional vibration approach is applied to newly developed interconnection pins. Using two-dimensional vibration for bonding requires identification of suitable bonding parameters. Even though simulation models of wire bonding processes exist, parameters for the two-dimensional pin-bonding process cannot be derived accurately yet. Within this contribution, a methodology and workflow for experimental studies identifying a suitable bond parameter space are presented. The results of a pre-study are used to set up an extensive statistical parameter study, which gives insights about the bond strength change due to bond process parameter variation. By evaluation of electrical data captured during bonding, errors biasing the resulting shear forces are identified. All data obtained during the experimental study is used to build a statistical regression model suitable for predicting shear forces. The accuracy of the regression model’s predictions is determined and the applicability to predict process parameters or validate simulation models is assessed. Finally, the influence of the tool trajectory on the bond formation is determined, comparing one dimensional, elliptic and circular trajectories.


Open list in Research Information System

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