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Experiments with the bonding machine Show image information
Quality evaluation of bonded interconnects using a shear tester. Show image information
Reliability analysis of a friction clutch. Show image information
Lab work in teaching. Show image information
Transport of fine powder using ultrasonic vibrations Show image information

Experiments with the bonding machine

Quality evaluation of bonded interconnects using a shear tester.

Reliability analysis of a friction clutch.

Lab work in teaching.

Transport of fine powder using ultrasonic vibrations

Lab Equipment

Our laboratories are extensively and versatilely equipped. We have a wide range of equipment for control and power electronics for piezoelectric and electromagnetic actuators. Devices for measuring electrical voltages and currents, forces and deformations (strain gauges) are part of our standard equipment. We manufacture experimental setups and prototypes in our own workshop with lathe, milling machine, 3D printing, etc. or in the central workshop of the faculty.

Contact

Dr.-Ing. Tobias Hemsel

Dynamics and Mechatronics (LDM)

Head of Engineering, Team Leader "Ultrasonic Systems and Processes"

Tobias Hemsel
Phone:
+49 5251 60-1805
Fax:
+49 5251 60-1803
Office:
P1.3.31.3
Web:

Office hours:

by appointment

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