In­tel­li­gent pro­duc­tion of re­li­able cop­per bond con­nec­tions

The innovation project "Intelligent production of reliable copper bond connections" in the excellence cluster “it’s OWL” aimed to develop intelligent processes and systems that ensure reliable mass production of copper bond connections even under variable production conditions. The entire process of ultrasonic connection formation was modeled. This includes a friction model with a coupled connection model, the ultrasound softening effect and the wear of the bonding tool. In addition, a concept of a self-optimizing bonding machine was created, which adapts process parameters depending on disturbance variables such as wear.

The final report on the project can be found here in book form.

Publications created as part of the project can be found here.

business-card image

Dr.-Ing. Tobias Hemsel

Dynamics and Mechatronics (LDM)

Head of Engineering, Team Leader "Ultrasonic Systems and Processes"

Write email +49 5251 60-1805