Smart manufacturing of reliable copper bond connections
The innovation project ‘Intelligent Manufacturing of Reliable Copper Bond Connections’ within the it’s OWL Leading-Edge Cluster aimed to develop intelligent processes and systems that ensure the reliable mass production of copper bond connections, even under variable production conditions. To this end, the entire ultrasonic bonding process was modelled. This includes, amongst other things, a friction model coupled with a bonding model, the ultrasonic softening effect and wear of the bonding tool. In addition, a concept for a self-optimising bonding machine was developed, which adjusts process parameters in response to disturbance variables such as wear.
