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Experiments with the bonding machine Show image information
Quality evaluation of bonded interconnects using a shear tester. Show image information
Reliability analysis of a friction clutch. Show image information
Lab work in teaching. Show image information
Transport of fine powder using ultrasonic vibrations Show image information

Experiments with the bonding machine

Quality evaluation of bonded interconnects using a shear tester.

Reliability analysis of a friction clutch.

Lab work in teaching.

Transport of fine powder using ultrasonic vibrations

Dynamics and Mechatronics (LDM)
Student works

Current topics for student work can be found here.

Alternatively, you will find the tenders in our showcases in buildings P1 on level 3 (at our offices), P4 on levels 3 and 4, P5 on level 2 (opposite P5.2.01) and in P6 on level 1.

Contact

Dr.-Ing. Tobias Hemsel

Dynamics and Mechatronics (LDM)

Head of Engineering, Team Leader "Sensors, Actuators and Utrasound Technology"

Tobias Hemsel
Phone:
+49 5251 60-1805
Fax:
+49 5251 60-1803
Office:
P1.3.31.3
Web:

Office hours:

date by agreement

The University for the Information Society