Given the sometimes very time-consuming nature and the associated costs of experimentally optimising the wire bonding process, simulation is a key component as a development tool in the design of new wire bonding processes. Furthermore, despite the short process times and the small dimensions of the bonding tool and the wire, models provide a deep insight into the process sequences. Based on the models developed at the department, a model-based optimisation of the process parameters can be carried out.

As part of the“InCuB” project within the BMBF-funded “it’s owl” Cluster of Excellence, a model was developed that holistically represents the bond process in its key components. This model is being continuously refined in current research at the Chair. An approach involving co-simulation between MATLAB and ANSYS is being pursued. This model comprises an integrated finite-element model which calculates the instantaneous wire deformation and transfers the contact results to the MATLAB simulation. The model for wire deformation, which was previously based on machine learning, is being replaced by a physics-based material model derived from experimental investigations. In order to analyse the experimentally observed influence of substrate dynamics on the bonding result, the dynamic models in MATLAB have been extended to include a substrate model.