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Experimentelle Untersuchungen am Bondautomaten Show image information
Qualitätsbeurteilung von Kupferbondverbindungen am Schertester Show image information
Verlässlichkeitsanalyse an einer Reibkupplung Show image information
Schwingungsmessung und -analyse in der Lehre Show image information
Transport feiner Pulver mittels Ultraschall Show image information

Experimentelle Untersuchungen am Bondautomaten

Qualitätsbeurteilung von Kupferbondverbindungen am Schertester

Verlässlichkeitsanalyse an einer Reibkupplung

Schwingungsmessung und -analyse in der Lehre

Transport feiner Pulver mittels Ultraschall

Welcome to the Chair of Dynamics and Mechatronics (LDM)

Recent technologic advances involve multidisciplinary development and entails collaboration across disciplinary borders.  The development of new technical systems requires an interdisciplinary integration of different approaches from different disciplines. Therefore, Mechatronics is a key technology of the 21st century.

In research and academics, we are primarily concerned with modeling, simulation, reliability, optimization, operation, condition monitoring including diagnosis and prognosis of mechanical, mechatronic and intelligent technical systems. The Chairs’ main areas of research are nonlinear dynamics, contact mechanics, friction, condition monitoring, data analytics, reliability engineering, sensors, actuators and ultrasound technology. In these areas our research is driven by sustainable approaches.

This results in a broad range of academic and research opportunities with fascinating new tasks to be met every day. A few of these applications are presented on the pages of this website.

Please feel free to contact us if we can provide you with further information.

Due to the limitations of the corona pandemic, you can currently reach us mainly in the home office by email and phone. Your contacts can be found here.


Prof. Dr.-Ing. habil. Walter Sextro

Dynamics and Mechatronics (LDM)


Walter Sextro
+49 5251 60-1801
+49 5251 60-1803

Office hours:

By arrangement

The University for the Information Society