A newly designed vibrating system was set up which, thanks to multi-dimensional, multi-frequency excitation, provides sufficient ultrasound power to reliably connect semi-finished copper products with a larger cross-section (up to 3 mm2 instead of 0.3 mm2). The necessary ultrasound power (up to 300 W) is brought into the connection point gently and efficiently without causing damage. It has also succeeded in substituting the soldering process when setting plugs in power semiconductor modules. As a result, the efficiency of power semiconductor modules can be increased further in the future and thus contribute to a more efficient energy supply.
This project was funded by the European Regional Development Fund (ERDF). The publications created as part of the project can be found here.